Browse Prior Art Database

Vertical Packaging of Stacked Dies

IP.com Disclosure Number: IPCOM000198154D
Publication Date: 2010-Jul-27
Document File: 3 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

Vertical Packaging of Stacked Dies is described.

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Memory stack is widely used to get higher density memory package. However, thermal issue grows when we stack more and more dies, and the overall thickness is also an issue.

    This invention proposes to place stacked dies perpendicular to the PCB. In this case, the package will have two surfaces that would face the air flow. However, the package thickness (ball to top) would be much higher, but the form factor would be much smaller so may have denser total capacity per volume.

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