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Method and Apparatus for Employing External Heat Sinks on Laptop Computers

IP.com Disclosure Number: IPCOM000198319D
Publication Date: 2010-Aug-04
Document File: 1 page(s) / 19K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and apparatus for employing external heat sinks on laptop computers is disclosed. A “plug-in” radiative device is used for thermally coupling internal cooling systems such as, heat sinks or heat pipes to an external cooling device.

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Method and Apparatus for Employing External Heat Sinks on Laptop Computers

Disclosed is a method and system for thermally coupling internal cooling systems of a laptop computer to an external cooling device. A "plug-in" radiative device is disclosed that thermally couples internal cooling systems such as heat sinks and heat pipes to an external cooling device. The "plug-in" radiative device includes a rigid metal loop through which a working fluid, such as water, is circulated. One side of the rigid metal loop is maintained in contact with integral cooling systems of the laptop computer. The other side of the rigid metal loop is thermally insulated from the first side as well as from the interior space of the laptop. This facilitates in removing heat from the interior of the laptop and radiating it externally.

In a scenario, the external "radiator" may be made of a pump and a radiator with fan. In another scenario, the external "radiator" may include a solid state cooler, such as a Peltier device. The cooling capacity of the "plug-in" device is determined by the temperature of the working fluid, thermal conductivity of the "plug-in" device, and it's mating surface. Further, the surface area that remains in contact between the interior cooling mechanism and the "plug-in" device may also be utilized for determining the cooling capacity of the "plug-in" device.

An internal contact switch may also be provided for detecting the presence of the "plug- in" device in the...