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Thermal conduction cooling spring

IP.com Disclosure Number: IPCOM000198801D
Publication Date: 2010-Aug-17
Document File: 2 page(s) / 273K

Publishing Venue

The IP.com Prior Art Database

Abstract

ID670482

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ID 670482

Thermal conduction cooling spring

    Slotless and thin products rely on conduction cooling to remove heat from the electronics to the outer enclosure. For tolerance reasons, there is often a thin air layer between the heat sources and the enclosure, which acts as a thermally insulating layer. By its nature, the tolerance clearing have large relative gap tolerances, which cannot be easily accommodated for by conventional interface materials because these cannot accommodate large elastic deformations and high thermal conduction simultaneously.

    Very high in-plane thermal conductivity materials have become available, e.g. graphite based heatspreaders. It is foreseeable that this development will continue with the advance of research in grapheme layers. These novel heatspreaders enable the use of thin, flexible heat bridges, but they lack elasticity.

    It is proposed to combine the flexible high-conductivity material with a separate spring, e.g. a metal spring or a foam core into one thermal interface solution that has both high thermal conductivity and can accommodate large gaps and large relative gap tolerances.

Embodiment for cooling side lit led displays to the back cover in ultra-thin or slotless TV

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    Embodiment with Flexible heatspreader outer tube with smaller diameter elastic foam core

Embodiment with Alternative plastic spring

    Alternative embodiments are with the flexible heatspreader fo...