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Dry method for selective removal of thermal release tape residue from graphene

IP.com Disclosure Number: IPCOM000199437D
Publication Date: 2010-Sep-03
Document File: 1 page(s) / 24K

Publishing Venue

The IP.com Prior Art Database

Abstract

Thermal release tapes such as Nitto Denko 3193MS are now widely used to transfer graphene layers from a growth substrate to a handle substrate, but they typically leave a residue on the transferred graphene. It is disclosed that oxygen annealing in the temperature range of 400-450 oC may be used to selectively remove tape residue while leaving the graphene layers intact.

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Dry method for selective removal of thermal release tape residue from graphene

    Thermal release tapes such as Nitto Denko 3193MS are now widely used to transfer graphene layers from a growth substrate to a handle substrate [*], but they often leave a residue on the transferred graphene. While this residue may be removed with solvent-based methods [*], dry methods are often preferable.

    It is disclosed that oxygen annealing in the temperature range of 400-450 oC may be used to selectively remove tape residue while leaving the graphene layers intact. The process is simple, and well suited for use with handle substrates that can withstand exposure to oxygen at moderately elevated temperatures.

Nominally identical samples of Si/SiO

piece of Nitto Denko 3193MS single-sided thermal release tape to each of several Si/SiO

nm) substrate pieces. The samples were heated on a hot plate in air at 120 oC for 1 minute to release the tape. A thin residue of the thermal release layer (appearing as a sea green layer compared to the violet-bluish color of the bare Si/SiO2 substrate) remained. Stylus profilometry indicated that the residue was smooth and about 13-14 nm thick.

    Samples were given one of the following treatments after the initial 1 min hot plate treatment at 120 oC:

No treatment (i.e., a total of 1 min on the hot plate)

4 minutes on the hot plate (i.e., a total of 5 min on the hot plate)
99 minutes on the hot plate (i.e., a total of 100 min on the hot plate) 10 min furnac...