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Hemispherical Heatsink with Multi-Axis-Symmetrical Fins

IP.com Disclosure Number: IPCOM000199641D
Publication Date: 2010-Sep-13
Document File: 2 page(s) / 49K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a description for an apparatus for a hemispherical heatsink with radially expanding fins which increases the cooling surface area for chip boards allowing a more flexible cooling method across the boards.

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Hemispherical Heatsink with Multi-Axis-Symmetrical Fins

With decreasing system board space and the increasingly powerful chipsets being

desired, flexible solutions for the efficient removal of heat from a system is increasingly

important. Some existing heatsinks currently use fins which extend radially around a

hemispherical heat sink in order to increase effective cooling surface area. Disclosed herein is a similar hemispherical heatsink except that rather than using flat,

radially extending fins, the fins are replaced with cylindrical or conical protuberances.

The primary advantage of this hemispherical heatsink over the conventional design is its

support for orientation along multiple axis, thus supporting a wider variety of airflow and

mounting options. By being symmetrical along multiple axis, fans, blowers, and other

cooling devices within a system can be placed in a wider array of locations within a

system and still present effective airflow across the heatsink. This is particularly

important in physically constrained environments where the potential locations for

mounting fans relative to heat sinks may be more limited.

The structure of the hemispherical heatsink apparatus for transferring heat from a

surface to the ambient air can include:
1. A flat surface effectively contacting the surface to be cooled
2. A hemispherical mounting surface coupled to said flat surface
3. An array of fins coupled to said mounting surface
4. Evenly-spaced placement of the fins...