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Method and System for Installing a Processor in a Land Grid Array (LGA) CPU Socket

IP.com Disclosure Number: IPCOM000199973D
Publication Date: 2010-Sep-22
Document File: 1 page(s) / 36K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system for installing a processor in a Land Grid Array (LGA) CPU socket is disclosed.

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Method and System for Installing a Processor in a Land Grid Array (LGA) CPU Socket

Disclosed is a method and system for installing a processor in a Land Grid Array (LGA) CPU socket.

The method and system disclosed herein slides the processor into a retention tray that is placed above the LGA CPU socket as illustrated in the figure. The retention tray has a backstop that comes in contact with a side of the processor. In an instance of the method and system, the backstop may have a small detent on the insertion side that attaches to the top portion of the processor upon full insertion of the processor into the retention tray. A slot is provided on the top portion of the retention tray to enable a heat sink or a cooling device to be connected to the processor. Additionally, an intermediate layer composed of suitable materials may be provided between the processor and the heat sink. The bottom portion of the retention tray includes rails placed along the axis of insertion of the processor. The rails enable the processor to be placed in a manner such that the retention tray does not contact the pins on the processor and does not impede the connection between the processor and LGA CPU socket. The retention tray is thereafter pushed manually in a downward direction to enable the processor to connect with an elevated platform housing the pins of the LGA CPU socket. Subsequently, the retention tray is secured in place using spring loaded screws. Additionally, guideposts a...