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Enhanced and Efficient Heat Sinks Circuit Card Retainer Wedge-lock Apparatus

IP.com Disclosure Number: IPCOM000200432D
Publication Date: 2010-Oct-11
Document File: 8 page(s) / 2M

Publishing Venue

The IP.com Prior Art Database

Abstract

This publication details how an enhanced circuit card retainer wedge-lock system can increase thermal conductivity, reduce thermal resistance and ensure adequate heat transfer from the printed wiring board to the chassis cold plate or heat exchangers. The Enhanced and Efficient heat sink circuit card retainer wedge-lock apparatus provides and covers a greater surface contact area between the wedge-lock and the chassis walls surface on the cold plate, which is optimal for ensuring an ideal heat transfer.

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Enhanced and Efficient heat sinks Circuit Card Retainer Wedge-lock Apparatus

By:

Nelson Canals

Jorge Estrada

Wiclyff Bonga

Abstract

This publication details how an enhanced circuit card retainer wedge-lock system can increase thermal conductivity, reduce thermal resistance and ensure adequate heat transfer from the printed wiring board to the chassis cold plate or heat exchangers.  The Enhanced and Efficient heat sink circuit card retainer wedge-lock apparatus provides and covers a greater surface contact area between the wedge-lock and the chassis walls surface on the cold plate, which is optimal for ensuring an ideal heat transfer.

Background/ Problem Statement

Today’s Technologies require high powered printed circuit card designs. The operation of these circuit cards or any other type of electronic equipment generates amounts of heat that could be detrimental to components reliability and that could precipitate systems failures. Heat can be removed from the circuit cards by conduction toward the chassis cold plate or heat sink using circuit card retainer wedge clamps. These wedge clamps should ensure lower thermal resistance and adequate heat transfer by providing and covering a greater surface contact area between the wedge-lock and the chassis wall surfaces on the cold plate.

Objective:

The objective of the present invention is to provide an improved circuit card retainer wedge-lock capable to provide maximum heat sinking efficiency, lower thermal resistance, better heat transfer and thermal path to the chassis heat sink with fewer components that are easy to install and align.

The new apparatus incorporates two threaded slider pieces and one stationary piece and a shaft screw (see Figures, below). The two slider a piece provide increased heat transfer and provides a greater surface contact with higher contact pressure between the printed wiring board surface and the chassis cold plate/ heat sink walls that is critical to promoting heat removal from high powered electronic components.

 In general, the printed circuit cards are retained in the chassis slots by a card wedge-lock, which is generally a thermal conductive metal block that is fastened along the printed circuit card to create a secondary thermal path to the cold plate or heat sink. The assembled printed wiring board and retainer wedge-lock is then slid into the slots of the cold plate. The Drive screw is then tightened to press the front wedge body parts against the sides of the chassis/cold plate slot walls to ensure heat transfer/removal from the printed circuit card to the chassis cold plate.

Solution / Advantage of the new Invention:

-The new apparatus provides and covers a greater surface contact area between the wedge-lock and the chassis walls surface on the cold plate. This will increase thermal conductivity and reduce thermal resistance through the retainer wedge-lock.

- The new apparatus has a wider material cross section. A wider cross-section surface will ensure...