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Dynamic zone cooling for energy savings

IP.com Disclosure Number: IPCOM000200628D
Publication Date: 2010-Oct-21
Document File: 3 page(s) / 31K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is method for utilizing the memory and the processer within a blade server system to create an intelligent and dynamic baffle system to more efficiently regulate the airflow and temperature control among components. The disclosed uses Shape Memory Alloy (SMA) actuators to direct the baffle to the zones requiring cooling, resulting in energy and cost savings.

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Dynamic zone cooling for energy savings

In current blade servers, the fan speeds are increased based on temperature control for critical components such as memory and processors. The fan's speeds generally increase as any one of the set temperature threshold values indicates that the server needs more air flow. Modular systems require the addition of ducting and an additional fan to cool the components.

For example, when a memory component is overheating in a server, the fan speeds increase based on the memory temperature threshold value, but the processor could still be below its temperature threshold and not require more cooling; therefore, the system is not utilizing the available air flow available to the maximum advantage. The problem is a lack of energy efficiency within the cooling process of a components-based system.

The disclosed solution is a dynamic baffle. The dynamic baffle addresses this issue and enables a very energy efficient cooling solution by maximizing the air flow available to the server: utilizing it where it is most needed and re-directing it from where is not greatly required.

There are baffles in current server designs to maintain air flow balance to the critical components based on the server layouts. That method is not the most efficient.

The disclosed makes the baffle intelligent and dynamic with the utilization of the memory and the processor.

The baffles are made dynamic using Shape Memory Alloy (SMA) actuators, which enable displacement of the baffle in the direction required when needed, and leave the baffle to take its original position when disabled. This displacement is obtained in two ways: either by thermal gradients causing the SMA to displace by deforming, or by providing current input to the SMA actuator that enables the displacement. In either case, when the thermal gradient or the power supply is disabled the baffle displaces to its original position.

A second embodiment of the idea is achieved by using a switch and regulator activation mechanism. For instance, if the power draw through the processor voltage regulator is over a specified threshold, then the system activates a switch which would in turn send a signal to the SMA actuator to displ...