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Selective Laser Sintering To Form a Package Substrate

IP.com Disclosure Number: IPCOM000200876D
Publication Date: 2010-Oct-27
Document File: 3 page(s) / 311K

Publishing Venue

The IP.com Prior Art Database

Abstract

A selective laser sintering process is described to create 3-D conductive interconnects in a packaging substrate. This eliminates the need for strictly 2D patterns with perpendicular via connections, allowing increased design density and flexibility. Such substrates can be used in 3-D packages, and can take any desired shape with any desired connection scheme.

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Selective Laser Sintering To Form a Package Substrate

Abstract

A selective laser sintering process is described to create 3-D conductive interconnects in a packaging substrate.  This eliminates the need for strictly 2D patterns with perpendicular via connections, allowing increased design density and flexibility.  Such substrates can be used in 3-D packages, and can take any desired shape with any desired connection scheme.

Discussion

Conductive pathways in package substrates and PCBs typically have routing layers formed in parallel planes in the X & Y directions.  Connections between the planes in the Z direction (aka vias) are always perpendicular.  Thus locations of features and functions on the X-Y plane are often constrained by the need to locate vias without interference.  Described here is a new structure that allows routing to occur at any angle to the Z axis.  Thus via placement keep-out zones need not be coincident on all layers.  This also eliminates the need for strictly planer X-Y routing.  Routing density and flexibility in the substrate can be improved.  There is the possibility to embed die in the package.  Any arbitrary 3D shape can be formed to be used in 3-D packaging applications.

Figure 1 shows a typical manufacturing flow for a 2 layer MAP-CSP substrate.  The frontend steps 1-3 form the primary conductive patterns of traces and vias, while the backend steps 4-7 create the finishing operations.  The mechanical drilling step 1 always created v...