Browse Prior Art Database

MIM-Cpacator: structure and fabrication

IP.com Disclosure Number: IPCOM000201141D
Publication Date: 2010-Nov-09
Document File: 7 page(s) / 153K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a description of a structure and fabrication method of 3D chip stack having a plurality of interfacial capacitors to allow improved performance, better design flexibility, and easier process control.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 77% of the total text.

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MIM-Cpacator: structure and fabrication

Problems in the conventional process:
Low Q Factor: limited area/ size and may rely on material change for performance enhancement
Design limitation
Topography Related Concerns/ Issues

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Problems Solved by the Present Invention:

High Performance: high Q factor by increasing the area/size (no material change) Better Design Flexibility
Easier Process Control

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The solution describes a structure and fabrication method of 3D chip stack having a p...