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Optimizing PCB Thermal Performance for Cree® XLamp® LEDs

IP.com Disclosure Number: IPCOM000201773D
Publication Date: 2010-Nov-22
Document File: 17 page(s) / 1M

Publishing Venue

The IP.com Prior Art Database

Abstract

This design note outlines a technique to assist with the development of cost effective thermal management for the XP and MX families of XLamp LEDs.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 7% of the total text.

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Optimizing PCB Thermal Performance for Cree® XLamp® LEDs

Table of Contents

1. Introduction.........................................................................................................................................2

2. Thermal Management Principles..............................................................................................................2

2.1 XLamp Thermal Characteristics.......................................................................................................2

2.2 PCB thermal characteristics............................................................................................................3

2.3 Designing Thermal Vias.................................................................................................................4

2.4 Open Vias vs. Filled Vias................................................................................................................5

3. Thermal Performance Simulations...........................................................................................................7

3.1 Surface Thermal Dissipation...........................................................................................................7

3.2 Thermal Dissipation with Vias.........................................................................................................8

3.3 Combined Surface and Via Studies................................................................................................ 11

3.4 Summary Results of Thermal Simulations...................................................................................... 13

4. Temperature Verification Measurements................................................................................................. 13

5. Recommended Board Layouts............................................................................................................... 14

5.1 FR-4 boards for XLamp XP Package............................................................................................... 15

5.2 FR-4 boards for XLamp MX Package............................................................................................. 16

6. Chemical Compatibility........................................................................................................................ 17

7. References......................................................................................................................................... 17

Application Note: CLD-AP37 Rev. 0

This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.

For warranty information, please contact Cree Sales at sales@cree.com. Subject to change without notice.

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1. Introduction

This design note outlines a t...