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Method and System for Determining Strength of a C4 Solder Joint

IP.com Disclosure Number: IPCOM000201782D
Publication Date: 2010-Nov-23
Document File: 2 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system for determining strength of a C4 solder joint is disclosed.

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This is the abbreviated version, containing approximately 100% of the total text.

Page 01 of 2

Method and System for Determining Strength of a C 4 Solder Joint

Disclosed is a method and system for determining strength of a C4 solder joint. The method and system disclosed herein provides quantification of strength values of a C4 solder joint. The method involves testing one edge of a chip at a time in a cantilever beam type test as illustrated in Fig. 1.

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Figure 1

As indicated in Fig. 1, the load is applied to the cantilever beam at an end. The probes as shown in Fig.1 are used to measure the strain experienced by the C4 solder joints due to the load. Here, the loading is displacement controlled and the load and deflection values are recorded until a C4 open condition is detected. The loading is displacement controlled, for example, 5mm/min. For example, four parts each of CuOSP and Ni/Au are received. Parts with CuOSP pad finish are determined to have a higher C4 strength and lower scatter than parts with Ni/Au pad finish as indicated by test results shown in Fig. 2. In general, a test may be applied to a solder type 1 and a solder type 2, or a strain rate 1 and a strain rate 2, etc.

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Figure 2

Thus, the method and system disclosed herein provides quantification of strength values of a C4 solder joint.

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