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One New Loop Mode Against the Vibration from Mold Clamp

IP.com Disclosure Number: IPCOM000202706D
Publication Date: 2010-Dec-23
Document File: 3 page(s) / 133K

Publishing Venue

The IP.com Prior Art Database

Abstract

The paper discloses a new loop mode in wire bond process against the vibration from Mold clamp, with curl on longer kink height like spring—spring loop mode. The new loop mode have the function of shocking absorption like spring, it’s also meant to reduce the vibration from mold clamp. Noted that the vibration from mold clamp can result in heel crack issue in molding process. Then, the heel crack issue is very difficult to be detected, specifically after wire bonding process. The new loop mode in wire bond process aims to reduce the vibration from Mold clamp to prevent the heel crack issue. The problem description and purposes of having this idea will be discussed; as well as the potential challenges and resolutions.

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One New Loop Mode Against the Vibration from Mold Clamp

Abstract

The paper discloses a new loop mode in wire bond process against the vibration from Mold clamp, with curl on longer kink height like spring—spring loop mode. The new loop mode have the function of shocking absorption like spring, it’s also meant to reduce the vibration from mold clamp. Noted that the vibration from mold clamp can result in heel crack issue in molding process. Then, the heel crack issue is very difficult to be detected, specifically after wire bonding process. The new loop mode in wire bond process aims to reduce the vibration from Mold clamp to prevent the heel crack issue. The problem description and purposes of having this idea will be discussed; as well as the potential challenges and resolutions.

Problem Description and Motivations

A new device with the ground ring design to improve package integrity is qualified soon. But E-Test fed back the Open/Short issue. After these failed units decaped, the heel crack issue was found on these wires with ground ring. During investigation, the issue didn’t occur in wire bond process. After process mapping and simulation experiment, concluded that mold process caused the heel crack issue. Refer to Fig 1, the ring of lead frame is squeezed upward when molding clamp is closed, it damaged the wire loop structure in result the heel crack issue in second bond. Thus, this triggers me to create a new loop in wire bond process to reduce the impact from mold clamp. ...