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Stackable Elastomeric Sheets for EMC and ESD Suppression

IP.com Disclosure Number: IPCOM000203463D
Publication Date: 2011-Jan-25
Document File: 4 page(s) / 434K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method to treat cooling pipe ingress or egress from a rack-based drawer computer system to improve shielding effectiveness of the enclosure. The conductive pipe that carries unwanted electromagnetic emissions transfers the energy onto a stackable set of elastomeric gaskets whereby the noise current is directed through components that effectively return the noise currents to the chassis.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 26% of the total text.

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High-frequency emissions (usually greater than 1GHz) that emanate from enclosure penetrations have always been a challenge to remove the internal energy before it couples to the outside. Also, the outside energy needs a
path away from sensitive internal electronics (both RF and ESD).

    The core purpose of the invention is to laminate or assemble a unique set of reconfigurable distributed components into one component that can direct, dissipate, or suppress energy that is entering or leaving a shielded enclosure.

    The basis for construction of a functional stack is shown below in five separate layers. The first three layers form interconnections within the stack. The last two layers provide a distributed component with differing edge connections. With these five configurations, many circuit functions may be formed just by adjusting the stackup order and distributed component values. Gasketting may be formed by die cut, water jet cot, or compression molded from alternately electrically insulative and conductive silicone rubber compounds. Available on the market is silverplated aluminum-filled, silverplated glass-filled, nickel graphite-filled, and carbon-filled rubber compounds meeting various mechanical and electrical properties. The structure can then be formed by patterned pressure sensitive adhesives between the layers.

    As shown in Figure 1, the green portion is a non-conductive portion of the elastomer while the brown indicates resistive or conductive and the gold indicates conductor. All drawings are exaggerated to show the internal construction and layup for discussion purposes. For ESD considerations, the distances between the conducting layers and the strength of the dielectric between the layers needs consideration to optimize the design. However, the essentials are displayed below.

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