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Method and System for Handling Wafer Pads during Testing

IP.com Disclosure Number: IPCOM000203523D
Publication Date: 2011-Jan-27
Document File: 1 page(s) / 20K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system for handling wafer pads during testing is disclosed.

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This is the abbreviated version, containing approximately 100% of the total text.

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Method and System for Handling Wafer Pads during Testing

Disclosed is a method and system for handling wafer pads during testing.

During initial levels of testing wafer pads get damaged due to probing, thus resulting in improper capping of Ultra-Low-Dielectric (ULK) depositions during subsequent levels of testing.

Accordingly, the method and system disclosed herein reduces damage caused to wafer pads during initial levels of testing.

The method and system utilizes a probe card designed using low force probes while testing wafer pads. In an instance, force probes used for testing are of the order 1.0 grams/mil of overdrive. Additionally, radial shaped probe needle tips are used during testing and a cleaning material is used to maintain the shape of the probe needle tips during testing. Further, wafer prober acceleration and deceleration settings are modified to ensure that a speed at which probe needle tips contact the wafer pads is reduced.

Thus, the method and system reduces damage caused to wafer pads by using a modified probe card, radial probe needle tips, a cleaning material for the probe needle tips, and modified acceleration and deceleration settings of the wafer prober.

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