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THROUGH-BOARD DETECTOR MODULE

IP.com Disclosure Number: IPCOM000206292D
Publication Date: 2011-Apr-18
Document File: 6 page(s) / 384K

Publishing Venue

The IP.com Prior Art Database

Abstract

A Cadmium Zinc Telluride (CZT) radiation detector module is designed to allow the CZT material to be separated from readout Application Specific Integrated Circuit (ASIC) while maintaining a low height profile above the motherboard. The electrical and mechanical connections between the CZT detector module and the ASIC extend through a cutout in the motherboard to eliminate the need for a pair of intervening connectors.

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RP13592

BRIEF ABSTRACT

    A Cadmium Zinc Telluride (CZT) radiation detector module is designed to allow the CZT material to be separated from readout Application Specific Integrated Circuit (ASIC) while maintaining a low height profile above the motherboard. The electrical and mechanical connections between the CZT detector module and the ASIC extend through a cutout in the motherboard to eliminate the need for a pair of intervening connectors.

KEYWORDS

    Cadmium Zinc Telluride (CZT), Application Specific Integrated Circuit (ASIC), CZT crystals, connectors, motherboard, detector module.

DETAILED DESCRIPTION

    Generally a large number of sensitive analog connections are required to be made between a Cadmium Zinc Telluride (CZT) crystal substrate and an Application Specific Integrated Circuit (ASIC). The number of such connections is typically as high as 121. It is desirable to be able to separate the CZT crystal substrate from a readout ASIC so that the readout ASIC may be replaced in the event of any damage done to it and thereby preserving expensive CZT crystals. Further, there is a need to connect the ASIC to a motherboard to provide input/output (I/O) power and ground. Additionally, there is a need to minimize the height of the detector module above the surface of the motherboard to minimize

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THROUGH-BOARD DETECTOR MODULE



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RP13592

overall size of the detector. Further, it is desirable to minimize the number of parts and connectors in the detector assembly and assembly steps involved such as attaching connectors to circuit boards.

    Conventionally, the CZT crystal detector is coupled directly to the ASIC module reduces stack height. However, by this technique separating the CZT crystal detector later is prevented. Alternately, the ASIC detector is coupled directly to the motherboard to reduce the number of parts used and the height of the detector module. But the yield from such an arrangement is not very close to 100% and the yield from multiple parts multiplies to give a poor overall yield. In another arrangement, the use of an additional pair of connectors between the CZT crystal and ASIC increases number of parts used, co...