Browse Prior Art Database

Si Carrier, Chip Stack and Integrated Modules with superior mechanical strength for manufacturing

IP.com Disclosure Number: IPCOM000206351D
Publication Date: 2011-Apr-19
Document File: 2 page(s) / 29K

Publishing Venue

The IP.com Prior Art Database

Abstract

Silicon carriers can benefit from the following designs and processes which help to enhance overall manufacturing yield of chip stacks, silicon carriers and modules having thinned silicon.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 52% of the total text.

Page 01 of 2

Si Carrier, Chip Stack and Integrated Modules with superior mechanical strength for manufacturing

1. Background: What is the problem solved by your invention ? Describe known solutions to this problem (if any). What are the drawbacks of such known solutions , or why is an additional solution required ? Cite any relevant technical documents or references .

Use of chip stack, silicon carriers and modules with thinned silicon of less than 300 microns and more specifically for silicon of less than 50 microns thickness can be impacted by ability to manufacture these structures without cracking and failures which impact yield

2. Summary of Invention: Briefly describe the core idea of your invention (saving the details for questions #3 below). Describe the advantage (s) of using your invention instead of the known solutions described above.

Thinned silicon can have defects which lead to failures in manufacturing. Incorporation of design features, processing and steps which avoid flaws which can significantly impact handling and reliability can be made to improve overall chip stack, silicon carrier and module level manufacturing yields

3. Description: Describe how your invention works , and how it could be implemented , using text, diagrams and flow charts as appropriate .

Silicon carriers can benefit from the following designs and processes which help to enhance overall manufacturing yield of chip stacks, silicon carriers and modules having thinned silicon.

      1. Si carrier or thinned silicon should be designed and fabricated with controlled edge quality such as benefiting from edge moat or RIE edge formation which also can also benefit from, curved corner radius, curved edge radius, and / or edge enhancement such as surface oxidation or oxidation/nitride. These characteristics would be superior over laser dicing and each superior over mechanical edge or wafer dicing or saw sizing.

      2. Si carrier or thinned silicon should have surface finish which has removed most or all surface defects which may come from mechanical grinding or polishing or alternate thinning technique. The thinned silicon can then be fine polished, and can benefit from c...