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Apparatus to Provide a Temporary Electrical Interconnect Along the Full Length of Flat Pack Integrated Circuit Device Leads

IP.com Disclosure Number: IPCOM000207312D
Publication Date: 2011-May-25
Document File: 2 page(s) / 126K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed are an apparatus and method to provide a temporary electrical interconnect along the full length of flat pack Integrated Circuit (IC) device leads. The invention facilitates the successful testing of the devices under extreme or unusual conditions.

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Apparatus to Provide a Temporary Electrical Interconnect Along the Full Length of Flat Pack Integrated Circuit Device Leads

The disclosed apparatus enables improved module testing of Integrated Circuit (IC) devices. This special clamping mechanism allows successful testing of devices under conditions requiring very high signal speed (>20GHZ) and very wide temperature range (-50 to + 125oC). In order to achieve this, an electrical connection had to be maintained between the entire length of an unformed long leaded device and strip line on test board. The device can also accommodate additional complexity in product design, such as four tie bars placed over the flat pack leads.

There were no other known solutions available.

The apparatus enables electrical connection through mechanical interference between long leads of a flat pack type IC package and printed circuit board lands (strips). It is capable of applying pressure to individual IC package leads to create direct contact with test board pads or strips. Such direct contact between IC device leads and test board pads (or strips) is desired for passing very high frequency electrical signals (>20GHz) from a tester to the IC device. The same apparatus can be used to provide a temporary IC device connection to system board for system level testing or device screening. A similar clamping concept can be used as a system socket, where permanent attachment of the device to system card is not desirable.

Conforming Vito...