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Dual Processor Adaptor with Cubical Heat Dissipation and Expansion Capability

IP.com Disclosure Number: IPCOM000208887D
Publication Date: 2011-Jul-21
Document File: 3 page(s) / 208K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method for connecting two processors into one socket while adding a unique heat sink and fan for cooling. The configuration may be expanded to extend the processors and/or support chips to an increased number to facilitate additional circuitry.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 48% of the total text.

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Packaging solutions are needed for multiple processor technologies that include attention to planar real estate, EMC, cooling, and nearby processor architecture. The following describes a dual processor arrangement, along with support chips and interconnection that optimize the cooling and interconnection and expandability of the structure. It can be described as cubical in shape in that each processor is mounted to the side of the cooling structure and electrically interconnected to each other and to the bottom connector to the planar board. The connection to the planar board and planar wiring needs to incorporate the bus architecture necessary to accommodate N processors which may consist of a processor bus or daisy chain and yet allow the placement in the socket with only one processor for the low-end model. Purpose would be to eliminate the need for having to swap in another planar card to implement an additional processor. The following diagrams illustrate the details of the invention. Figures 1 and 2 shows the overall view of the invention along with a mounted fan onto the cubical heat sink.

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    The basis for the structure is the cubical (or radial) heat sink, whereby heat producing devices may be mounted on opposing sides of the cube (see Figure 3). Because the heat sink is a cube, a fan may be mounted at the edge of the cube. Air moved by the fan is efficiently entered into the cube for heat removal. The center hole of the heat sink may be adjusted in diameter to adjust the cooling profile through the cube.

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    Shown in Figure 4 is the two processors interconnected by the flex board that connects to each processor and the planar board or between the two processors and the planar board. The flex board can stop at the edge of the top of the processor or extend over the top of the cube and provide another location where L2 Cache may be mounted. The top connector may be split (or board split prior to the connector) to allow an expansion of the modular cube up...