Browse Prior Art Database

Willey's Wafer Wand

IP.com Disclosure Number: IPCOM000215530D
Publication Date: 2012-Mar-06
Document File: 3 page(s) / 210K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is tong-like tool that enables an operator to clean foreign material off the backside of a wafer without touching the wafer with their hands. This device minimizes defect impact to the chip side of the wafer and brings a standard to wafer recovery.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 62% of the total text.

Page 01 of 3

Willey's Wafer Wand

The current solution for an operator to clean foreign material (FM) off the backside of a wafer is for them to hold the wafer by pinching the wafer between their hand and belly or placing the wafer face down on dry clean room wipes. These solutions cause yield loss, as the operator must contact the face or chip side of the wafer with gloves, clean room suite, or dry wipes. For a wafer fabrication facility (fab) that has a "no touch" policy however, in some cases backside FM causes extra handling/cleaning of the wafers by the operator to get them to run through a tool.

The disclosed invention enables an operator to clean foreign material off the backside of a wafer without touching the wafer with their hands. This device enables the removal of the FM without contacting the face of the wafer and brings a standard to wafer recovery while supporting the "no touch" policy. This minimizes defect impact to the chip side of the wafer.

The invention is a hand held tool that allows the operator to hold a wafer without touching it by a gloved hand in a way so that pressure can be applied to the back side wafer to clean off foreign material. This practice reduces scrap that occurs as the result of tool aborts caused by FM. The tool grabs the wafer by its edges; therefore, no contact occurs with either the back or front side of the wafer while the operator holds it. Grabbing only the outer most edge of the wafer minimizes chip defect fallout.

The device p...