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HDD structure for less thermal stress on soldering area in Sealed File

IP.com Disclosure Number: IPCOM000215876D
Publication Date: 2012-Mar-14
Document File: 2 page(s) / 63K

Publishing Venue

The IP.com Prior Art Database

Abstract

This invention presents the structure that assures long durability of wax joining between two parts. The wax joining portion between part 1 and part 2 is shown in the figure 1. The joining portion in the part 1 is a round shape and lower than the other portion as indicated in the figures 1 and 2. By changing the joining portion which is lower than the other portion and round to ellipse, the more longivity of joining between parts is realized.

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This is the abbreviated version, containing approximately 100% of the total text.

Page 01 of 2

HDD structure for less thermal stress on soldering area in Sealed File

  ろう材の流れを考えて部品1の接合面は図3のオリジナル形状のように円状 に一段低くなっている。

この一段低い円形状を図3の本発明のように長円形状にすることでろう接合 部にかかる応力を緩和し、

2部品の接合を長期にわたって保証する。

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Page 02 of 2

Disclosed by Hitachi Corporation

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