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A spice model based full environment thermal simulation system

IP.com Disclosure Number: IPCOM000219420D
Publication Date: 2012-Jun-28
Document File: 5 page(s) / 323K

Publishing Venue

The IP.com Prior Art Database

Abstract

“Temperature” is a key parameter during each semiconductor design level. This paper provides a system including models, methods and computer-readable codes for thermal simulation and analysis. In this method, the models are compact and mesh model combined, which can describe the blocks temperature profile and impaction maintaining accuracy and speed requirements. The thermal simulation can be run in SPICE simulator and it can be combined with circuit simulation based on the real-time circuit changing status. The chip, package, board and air conditions are modeled to support a whole environment during thermal simulation. The system can be integrated with commercial CAD tools or run with standalone mode. The system is configured for designers to directly use, with easy understanding setups and feasible functions. Designers can use it to do floor plan, schematic, layout and package thermal simulations to prevent thermal issues and reduce the design cycle.

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A spice model based full environment thermal simulation system

Abstract

“Temperature” is a key parameter during each semiconductor design level. This paper provides a system including models, methods and computer-readable codes for thermal simulation and analysis. In this method, the models are compact and mesh model combined, which can describe the blocks temperature profile and impaction maintaining accuracy and speed requirements. The thermal simulation can be run in SPICE simulator and it can be combined with circuit simulation based on the real-time circuit changing status. The chip, package, board and air conditions are modeled to support a whole environment during thermal simulation. The system can be integrated with commercial CAD tools or run with standalone mode. The system is configured for designers to directly use, with easy understanding setups and feasible functions. Designers can use it to do floor plan, schematic, layout and package thermal simulations to prevent thermal issues and reduce the design cycle.

1, Introduction and motivation

Thermal problems are important during device scaling down and more so for some technologies and applications. Traditionally, there are compact and mesh thermal models. But the mesh model consumes a lot simulation time. The compact model can’t show the temperature map. So the compact plus mesh model is needed.

Current thermal simulations provide just chip plus package thermal model;  air and board information are not included. Current commercial thermal analysis tools have additional disadvantages. First, they are too complicated and professional for designers to directly use. So the package, board level thermal analysis is finished by specialists, not by general designers. This increases the design cycle time. Second, analysis is performed at package level. So the thermal problem can’t be evaluated at floor plan, schematic and layout levels. Third but not the last, their simulations can’t be directly linked with circuit simulation. So their thermal simulation is based on average power dissipation, not directly monitored during the circuit simulation.

In this case, it is need to build a model and corresponding simulation flow to handle these listed problems. In this publication, a SPICE model based full environment thermal simulation system is introduced. First, what is the method is detail introduced with the flow chart. Then how to use is introduced. At last, a simulation result data and the output diagram are presented as an example.

2, What is the method

This method contains several components.

Component 1: release a file written by SPICE language, in which the thermal resistor, thermal capacitor and air flow conditions are modeled. This component is not technology based.

 

Component 2: release a set of files to describe different package and board types. Each type of package and board are defined by several layers. The name, material thermal resistance and capacitance, thicknes...