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5 hole QFN Pickup Vacuum cup

IP.com Disclosure Number: IPCOM000223078D
Publication Date: 2012-Nov-01
Document File: 3 page(s) / 227K

Publishing Venue

The IP.com Prior Art Database

Abstract

This paper discloses a new method that uses a Torlon insert with an array of holes that is inserted into the existing vacuum cup. This mechanism is used to pick up QFN packages with air vent holes. The quantity of holes array in the tip can be increased / decreased based on the number of vent holes in the package.

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5 hole QFN Pickup Vacuum cup

Abstract

This paper discloses a new method that uses a Torlon insert with an array of holes that is inserted into the existing vacuum cup. This mechanism is used to pick up QFN packages with air vent holes. The quantity of holes array in the tip can be increased / decreased based on the number of vent holes in the package.

Problem description & Motivation

The existing QFN package has a sealed mold package top. With this package configuration, the existing vacuum cup design & concept can be used. The future QFN packages are coming with vent holes on the top of the packages.

Fig 1 Single hole QFN vs Five Hole QFN Package

This vent holes positions are on vacuum cup area & therefore not giving a vacuum sealed area for the existing vacuum cup to work. The units drop during pick up due to NON sealed area for vacuum. In order to enable pick up units for testing on the existing handler, a new design of vacuum cup concept & design is introduced.           

Figure 2 Existing Pickup mechanisms using existing vacuum cup

Comparison current and new technique

The idea of pickup mechanism is by using an insert on the existing pick up vacuum cup. This pickup tip is an insert & is add on option to the existing vacuum cup. This insert is made out of Torlon or any other high temp engineering plastic with good ESD & thermal property as required for semiconductor testing. This insert has an array of holes with pre-defined diameter. This holes sits on the are...