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Focus ring

IP.com Disclosure Number: IPCOM000223865D
Publication Date: 2012-Dec-04
Document File: 1 page(s) / 519K

Publishing Venue

The IP.com Prior Art Database

Abstract

Problem: When deposing a film by PECVD, thickness of film near wafer edge is generally irregular. In order to improve the uniformity, a focus ring made from ceramic is mounted around the wafer to change plasma density around wafer edge. This improves the uniformity. However, we have not found suitable size of ceramic ring yet. Solution: We found that 0-3.5mm gap between the wafer edge and the ceramic ring and 3-15mm thickness can improve the uniformity.

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Focus ring

Focus ring

Problem: When deposing a film by PECVD, thickness of film near wafer edge is generally irregular. In order to improve the uniformity, a focus ring made from ceramic is mounted around the wafer to change plasma density around wafer edge. This improves the uniformity. However, we have not found suitable size of ceramic ring yet.

Solution: We found that 0-3.5mm gap between the wafer edge and the ceramic ring and 3-15mm thickness can improve the uniformity as indicated in figures 2 and 3.

Fig. 1

Fig. 2 Fig. 3