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Data Converter Die, Package, Board Co-Design and Validation Method

IP.com Disclosure Number: IPCOM000225336D
Publication Date: 2013-Feb-11
Document File: 6 page(s) / 420K

Publishing Venue

The IP.com Prior Art Database

Abstract

Die, Package and board co-design for high speed interfaces are done today e.g. DDR. But this method is not used for analog interfaces like Data converters. Data converters are susceptible to failures if the package and board are not design as per the needs. We present a method to co-design data converter die, package and board to have a reliable performance in field

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Data Converter Die, Package, Board Co-Design and Validation Method

Abstract

 Die, Package and board co-design for high speed interfaces are done today e.g. DDR. But this method is not used for analog interfaces like Data converters. Data converters are susceptible to failures if the package and board are not design as per the needs. We present a method to co-design data converter die, package and board to have a reliable performance in field

Contents

Motivation for this method

 Design of data converter must be complemented with package, board, clocking design and a unique validation method to predict ADC parametric on field in-line with exact board design methods. Reduce cycle time of debug, reduce CQIs, reduce poor practices of software, board etc. Few key areas of interest in data converter subsystem are:

ü Large channel muxing leads to sampling issues and THD issues/SNR issues

ü Clocking also impact dynamic characteristics of the ADC if clock source has high jitter

ü Analog supply/channels may have noise coupling in package which can make a

Good design look worse post silicon

Such complex situation needs a methodical and systematic approach to design of die, package and board followed by defined analog validation method

ü Robust Die, Package, Board and validation co-design to reduce NPI cycle time ( Its

Done for digital and high speed IPs but not existing for data converters)

ü Quote Data converter parameters in Datasheet in-line to specific board

Recommendations (apart from the die design and package design). This is not

done today and hence causes lots of churn due to customers not having complete

knowledge on data converter requirements

The Method

The proposal presents an integrated approach which involves ADC architecture functionality , packaging , board design and validation method to give customers “exact requirements for ADC usage(board,software,functionality)” for field applications

Board Design Example

Data converters have many things to look for into board design. These are

ü Current limiter for injection current(RL in figure 2)

ü Low pass filter for noise elimination(Rf & CF in figure2)

ü Filter Cap ( Also for acquisition from high impedance sources )

ü Ferrite protection or not for supply and ground schemes

ü Clocking options , if from the board

The theoretical analysis for SNR requirement(e.g. 69db in figure2) and the dynamic frequency of the input signal is used to identify the board component and the board is built with these components

                                                    

The example in figure3 is a theoretical analysis to identify Board filter components based on “input signal frequency” and SNR requirement. It also identifies is the filter cap for cases of signals with infinite impedance (or near about) as acquisition capacitance.

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