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Method for Wettable flank on QFN with lead standoff

IP.com Disclosure Number: IPCOM000225340D
Publication Date: 2013-Feb-11
Document File: 4 page(s) / 146K

Publishing Venue

The IP.com Prior Art Database

Abstract

Customers require a solution to incorporate Inspectable Joint (IJ) onto QFN parts. Current design & solutions available do not have a method to create the Inspectable Joint (IJ) with a lead stand-off. This document provides a method to create an Inspectable Joint(IJ) with an integrated stand-off feature for better solder wettability.

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Method for Wettable flank on QFN with lead standoff

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Abstract

Customers require a solution to incorporate Inspectable Joint  (IJ) onto QFN parts. Current design & solutions available do not have a method to create the Inspectable Joint  (IJ) with a lead stand-off.  This document provides a method to create an Inspectable Joint(IJ) with an integrated stand-off  feature for better solder wettability.

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1.0  Problem Description

Customers are currently requesting semiconductor manufacturer to provide a solution to incorporate Inspectable Joint (IJ) on QFN parts. Current designs available provide a way for the leads to wet at areas where the solder, after mounting is able to be viewed from the tip end of the leads and not its sides. The current solutions provided do not have a method to create the Inspectable Joints(IJ) at the tip and sides, and do not have stand-off leads for better wettability.

2.0 Proposed Solution

The solution is illustrated below in Figure 1.

 

Figure 1. Inspectable Joint  (IJ) with a lead stand-off for better wettability.

2.1 Major Process steps.

2.1.1 Leadf...