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Multi-purpose Integrated Chip Carrier Lid Design

IP.com Disclosure Number: IPCOM000225366D
Publication Date: 2013-Feb-12
Document File: 3 page(s) / 56K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a design for a chip carrier module lid that contacts the laminate on the edge and/or corners of the package, which then allows full use of the top surface of the laminate.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 69% of the total text.

Page 01 of 3

Multi-purpose Integrated Chip Carrier Lid Design

The main purposes of a chip carrier module lid are:


1. To aid the heat removal from chip into external heatsink


2. To meet the finished module co-planarity spec


3. To enhance mechanical stability of module structure


4. To protect chip and passive on module from shipping and handling damage

However, the present chip carrier module lid restricts the available area on the top surface of a package laminate for a large chip, passive components which in some applications would drive the need for a larger and more expensive module. The larger module also could cause performance hit in some applications. The direct lid attach (DLA) lid is one of the solutions but it does have restrictions on the type of chip carrier (can be used only for thick core laminate).

Figure 1: Illustration of the problem

The solution is to add a lid that contacts the laminate on the edge and/or corners of the package, which then allows full use of the top surface of the laminate.

Variations of this approach include:


• Extend the lid to the card with 'post'


- Ground lid for EMI


- Can be used as module stand-offs for Ball Grid Array (BGA) side decaps

- Improves second-level assembly:
Modules with a tight BGA pitch
Module that require a low height which drives the need of a smaller BGA diameter


- Adds mechanical stability to the module


• Allows top surface wiring of high-speed signals out to the perimeter of the package (high speed signals wired...