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A new one-piece-lid (OPL) design for packages w/ space constraints in Z direction

IP.com Disclosure Number: IPCOM000226563D
Publication Date: 2013-Apr-16
Document File: 6 page(s) / 117K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed are designs to cool 2D and 3D chip stacks with space constraints in Z direction. The invention enhances heat transfer from a chip or chip stack by implementing a new one-piece-lid (OPL) design with conductive members when a traditional heat sink is not allowed due to the space constraints.

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A new one-piece-lid (OPL) design for packages w/ space constraints in Z direction

The problem solved by this invention is related to cooling of 2D, especially 3D chip stacks with space constraints in Z direction as shown the Figures 1-6. The state of the art is simply a very thin metal slice attached to the top of the lid using high thermal impedance pressure sensitive adhesive. The known solution has very limited capacity to dissipate heat for high power packages, especially the cases without fan or with very low airflow rate. The attachment method is also a concern in environments that experience vibration.

The invention proposed here enhances heat transfer from a chip or chip stack by implementing a new one-piece-lid (OPL) design with conductive members when a traditional heat sink is not allowed due to the space constraints. The proposed invention enhances the heat transfer significantly to achieve thermal performance required for high power packages with space constraints, especially for those with relatively high module height (3D chip stacks) and/or with low system or localized airflow rates.

Figure 1: Design 1: Application for Package with Space Constraints in Z Direction

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Figure 2: Design 2: Application for Package with Space Constraints in Z Direction

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Figure 3: Design 3: Application for Package with Space Constraints in Z Direction

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Figure 4: Design 4A: Application for Package with Space Constraints in Z Direc...