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Miniaturized Wafer Level Chip Scale Package Pressure Sensor

IP.com Disclosure Number: IPCOM000229472D
Publication Date: 2013-Jul-31
Document File: 4 page(s) / 155K

Publishing Venue

The IP.com Prior Art Database

Abstract

MEMs based Pressure Sensors have three different dies, a microcontroller (MCU), a gyroscopic die (G-cell), and a MEMs membrane based pressure sensing die (P-cell), which usually are configured as multi-die, planar packages. The three dies need to be interconnected, as well as provide external connections. Like other IC packages, these dies and interconnects have to be protected such as with a plastic encapsulant. The P-cell requires a very low stress level type of encapsulation, which usually is some form of gel while the other two dies require a stronger encapsulation such as a standard mold compound. Due to the disparate encapsulation materials needed, assembly of the pressure sensor package requires additional steps and process investment, making it cumbersome and costly. In this paper we propose a more cost effective and streamlined assembly process.

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Document Title 

Miniaturized Wafer Level Chip Scale Package Pressure Sensor

 

Abstract / Introduction

MEMs based Pressure Sensors have three different dies, a microcontroller (MCU), a gyroscopic die (G-cell), and a MEMs membrane based pressure sensing die (P-cell), which usually are configured as multi-die, planar packages.  The three dies need to be interconnected, as well as provide external connections.  Like other IC packages, these dies and interconnects have to be protected such as with a plastic encapsulant.  The P-cell requires a very low stress level type of encapsulation, which usually is some form of gel while the other two dies require a stronger encapsulation such as a standard mold compound.  Due to the disparate encapsulation materials needed, assembly of the pressure sensor package requires additional steps and process investment, making it cumbersome and costly.  In this paper we propose a more cost effective and streamlined assembly process.

Body 

Numerous multi-die MEMs based sensor packages are currently in HVM production.  These package designs come in two general configurations.  The first is where cavity openings are purposely created during encapsulation of the other two dies (MCU and G-cell).  The P-cell is then placed inside the cavity, wire bonded, covered with gel, and then the cavity is capped with a lid.  In the second configuration, encapsulation is not used but the entire package is protected by a lid.  In the first configuration, as mentioned in the previous paragraph, the assembly process is costly and cumbersome.  The second configuration however can be very low cost but suffers from very low reliability.  We propose a miniaturized, wafer level CSP pressure sensor package with wire interconnection from the P-cell and G-cell to the MCU using through silicon via (TSV) technology.  The important component of the package is the TSV structure in the MCU with wire interconnection from the P-ce...