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System for Structurally Coupling a Heat Sink and a Card Latching Assembly

IP.com Disclosure Number: IPCOM000233982D
Publication Date: 2014-Jan-06
Document File: 5 page(s) / 730K

Publishing Venue

The IP.com Prior Art Database

Abstract

A system for structurally coupling a heat sink and a card latching assembly is disclosed.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 52% of the total text.

Page 01 of 5

System for Structurally Coupling a Heat Sink and a Card Latching Assembly

Traditionally, a compliant latching scheme is mounted directly to a card assembly.

As mechanical plug forces increases, an ability of the card assembly to withstand the forces is stressed. For coupling of the heat sink to the card assembly, a series of metallic stand-offs epoxied to the card assembly is utilized. Although an impact

on the card's physical form factor is minimized, the ability to confidently utilize the heat to structurally support the card assembly during connector mating is limited.

Disclosed is a system for structurally coupling a heat sink and a card latching assembly. The system includes two designs to structurally couple the heat sink and the card latching assembly. In the first design, the system couples a latching assembly of the card and heat sink to a card assembly to enhance an overall structural robustness of the card assembly. Fig. 1 illustrates an assembled view of a structurally coupled a heat sink and a latch bracket.

Figure 1

Fig. 2 and Fig. 3 illustrate comparative views of analysis models with and without the structurally coupled heat sink attachment.

Figure 2

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Page 02 of 5

Figure 3

Fig. 4 provides Fine Element (FE) analysis results of a predicted card strain without structurally coupling the heat sink to the card assembly. In all cases shown in Fig. 4, exposure to excessive strains levels is predicted in areas where surface mount components are mounted.

Figure 4

Fig. 5 provides FE analysis results predicting a latch bracket design factor of safety

without the structurally coupled heat sink. In all cases shown in Fig. 5, a design solution predicts a yielding of the design.

2


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Figure 5

Fig. 6 and Fig. 7 provide comparative FE analysis results of the design with and

without the structurally coupled heat sink attach...