Method and System for Providing a Solder Heat Sink in Stacked-Chip Systems for Improving Thermal Conductivity
Publication Date: 2014-Jan-21
The IP.com Prior Art Database
A method and system is disclosed for providing a solder heat sink in stacked-chip systems for improving thermal conductivity. The solder heat sink is provided between one or more chips that are interconnected and are piled to form a stacked-chip system. The solder heat-sink improves thermal conductivity between the one or more chips.
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Method and System for Providing a Solder Heat Sink in Stacked - Improving Thermal Conductivity
Disclosed is a method and system for providing a solder heat sink in stacked-chip systems for improving thermal conductivity. A stacked-chip includes one or more chips that are interconnected and are piled to form the stacked-chip system. The one or more chips form an inter-chip electrical insulating material allowing more thermal conductivity.
In accordance with the method and system, as shown in the figure 1 below, the solder heat sink is provided between one or more chips of stacked-chip system.
-Chip Systems for
Chip Systems for
The solder heat sink is thermally introduced between one or more chips to obtain micro-C4 type solder connections. The micro-C4 type solder connections give the inter-chip electrical insulating material a new structure with modified surface area contact. The structure thus particularly increases top-down perimeter (surface area contact) of the thermally-conductive inter-chip material. The increased top-down perimeter forms a comb structure which allows more flow of heat, both in vertical and horizontal directions of inter-chip electrical insulating material, as shown in the figure 2.
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The micro-C4 type solder connections maximize thermal conductivity of inter-chip material used in one or more applications such as but not limited to, analog chips/circuit areas, power amplifier circuits in high-frequency RF/mix...