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Chip Package Signal Interceptor

IP.com Disclosure Number: IPCOM000234715D
Publication Date: 2014-Jan-30
Document File: 2 page(s) / 155K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a novel solution to alter existing chip package signal connections, termination, and interfacing schemes without the need for package redesign.

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This is the abbreviated version, containing approximately 84% of the total text.

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Chip Package Signal Interceptor

This invention provides a novel solution to alter existing chip package signal connections, termination, and interfacing schemes without the need for package redesign. As depicted in the figure below, the base concept of this invention is an electrically interruptible chip carrier and/or interposer packaging solution allowing for selectable pass-through and/or interrupted signal paths, enabling modifications to existing chip IO without requiring derivation of a new chip carrier (package) which enables the following additional inventions:

Re-direction of transmit (Tx) signal back to a receive (Rx) of the same chip - highly valuable


1.

for bring-up and self-diagnostic purposes.

Interrupt a Tx connection from the PCB, and re-direct it to a desired off-chip termination for


2.

purpose(s) of signal probing.

Break Power pin connection from the PCB and re-direct it to off-chip termination to validate


3.

on-die power distribution noise measurement.

Disconnect Rx connection from a PCB trace in question, so that it's not connected to the chip,


4.

thereby re-directing it to off-chip termination for signal probing of a transmitted signal without receiver loading.

Create an optical transmission vehicle from an existing electrical-only module.


5.

Create additional connections between any two modules without changing the physical PCB


6.

design.

Dramatically increase the number of loads which can be applied to a transceiver without


7.

adding paras...