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Board Stiffener As An Air Sharing Plenum And A Heat Sink

IP.com Disclosure Number: IPCOM000234795D
Publication Date: 2014-Feb-05
Document File: 2 page(s) / 166K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a novel board stiffener design in which the airflow path for power components can be separate from the main stream for the drawer. This design provides parallel or independent cooling air streams for the power components while remaining flexible enough to accommodate the physical serial arrangement for logic and power components.

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Board Stiffener As An Air Sharing Plenum And A Heat Sink

Computer server thermal architecture is challenging due to increasing power density, constraints in physical space, and service/reliability requirements. From a thermal perspective, logic components such as processors and Dual In-Line Memory Modules (DIMMs) remain the highest priority in cooling needs. Cooling for power supply components requires improved focus due to higher expectations for reliability/availability.

Traditionally, the power supply shares the air stream with the node and often receives pre-heated air due to upstream logic components. This often limits the cooling capability of the power supply. On the other hand, when there is a power

supply failure, the remaining power supplies pick up the workload, which often

requires more cooling, causing the main blower/fan to spin much faster. This often causes more power consumption by the blowers and more noise for the system.

Current systems are unable to use the preheated exhaust air from the processors and DIMMS to adequately cool a printed circuit card assembly with heated components in a circuit drawer, when the circuit card is connected to the common

midplane with the processors and memory, and needs to be placed on the exhaust end of the drawer (for accessibility, etc.).

A thermal architecture is needed that provides parallel or independent cooling air

streams for the power components while remaining flexible enough to accommodate

the physical serial arrangement for logic and power components.

The solution is a novel board stiffener design in which the airflow path for power components can be separate from the main stream for the drawer. Fresh air is supplied to multiple downstream power suppliers. It also allows sharing between the different power supplies. In addition, the stiffener can serve as a heat sink for the main drawer motherboard, especially for areas where current crowding is a concern.

In addition to acting as a global mechanical support structure, the stiffener plate serves as a separator between the two air str...