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A Unified Electromagnetic Model of TEM Cell with SOC and Flow for Early Estimation of Radiated Emission of SOC

IP.com Disclosure Number: IPCOM000234800D
Publication Date: 2014-Feb-06

Publishing Venue

The IP.com Prior Art Database

Abstract

Electromagnetic compliance is now an essential part of an IC design specification. Meeting these complex specifications is now a very challenging task. Most often, EM radiation behavior can only be estimated in the last stages of back end simulation followed by EM field solution. In this paper, we propose a modelling methodology where we first convert the complex geometry of the Transverse Electromagnetic Cell (TEM), which is a standard instrument of EM emission measurement for compliance testing. The complex geometry of the TEM cell is converted to a simple geometry through the Schwartz-Cristofel transformation, thereby allowing a closed form solution. From this closed form expression, we obtain the electrical equivalent circuit of the TEM cell. We also demonstrate the methodology of converting the SOC’s geometry and into an antenna model, which is followed by conversion of the antenna model to an electrical equivalent. Finally, we unify these two models into one electrical model, which is used to predict the Radiated Emission captured by the TEM cell measurement. The accuracy of this model has been verified against silicon measured and excellent results obtained. The model and the tool developed from it allow prediction of EM radiation from a SoC at an early stage of design.

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A Unified Electromagnetic Model of TEM Cell with SOC and Flow for Early Estimation of Radiated Emission of SOC

Abstract— Electromagnetic compliance is now an essential part of an IC design specification.  Meeting these complex specifications is now a very challenging task.  Most often, EM radiation behavior can only be estimated in the last stages of back end simulation followed by EM field solution.  In this paper, we propose a modelling methodology where we first convert the complex geometry of the Transverse Electromagnetic Cell (TEM), which is a standard instrument of EM emission measurement for compliance testing.  The complex geometry of the TEM cell is converted to a simple geometry through the Schwartz-Cristofel transformation, thereby allowing a closed form solution.  From this closed form expression, we obtain the electrical equivalent circuit of the TEM cell.  We also demonstrate the methodology of converting the SOC’s geometry and into an antenna model, which is followed by conversion of the antenna model to an electrical equivalent.  Finally, we unify these two models into one electrical model, which is used to predict the Radiated Emission captured by the TEM cell measurement.  The accuracy of this model has been verified against silicon measured and excellent results obtained.  The model and the tool developed from it allow prediction of EM radiation from a SoC at an early stage of design.

I.     Introduction

Operation of digital integrated circuits (ICs) drive the electromagnetic emissions of electronics system, hence ICs like microprocessors and microcontrollers can be considered as primary source of electromagnetic emissions (EMEs).

Sharp rise/fall of the pulsed current flowing through IC package leads/wire bond excites IC direct radiations of interfering electromagnetic fields. Furthermore steep current and voltages glitches on the IC power supplies which are feeding the Input/Output(I/O) pad of the IC and the signals carried by the I/O pad results in the noise source which drives the traces of the PCB as an antenna resulting in what is called as Conducted Emission [1]. IC radiated and conducted emissions heavily influence the Electromagnetic Compliance (EMC) features of the electronic apparatus, hence the right selections of the ICs, from the EME point of view, implies a reduced number of EMI filters at the PCB and system level, necessary to compliant with system level EMC requirements [2]. For this reason it is now mandatory specifications for the microcontroller and microprocessor designer to compliant with the specification laid down by the system level companies.

The twin standards SAE J1752/3 [3] and IEC 61967-2 [4] has recognizes the importance of the IC emissions and describes the procedures for evaluating the procedures of Electromagnetic compatibility of the integrated circuits. These procedures call for the IC to be mounted on 10cm X 10cm on the printed circuit board with IC being evaluated on one side a...