Browse Prior Art Database

Compact Mold for Transfer Molding

IP.com Disclosure Number: IPCOM000234816D
Publication Date: 2014-Feb-07
Document File: 2 page(s) / 188K

Publishing Venue

The IP.com Prior Art Database

Abstract

Typical mold delamination and mold voids are related to the compactness of the molding compound /epoxy or related to the transfer process. To resolve this phenomena, there are several approaches which can be deployed ie mold design, molding parameters and molding compound materials. This innovative design will seek to address all the 3 factors altogether with an innovative approach to combine both transfer and compression molding at one station.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 77% of the total text.

Document Title 

Compact Mold for Transfer Molding

Abstract 

Typical mold delamination and mold voids are related to the compactness of the molding compound /epoxy or related to the transfer process.  To resolve this phenomena, there are several approaches which can be deployed ie mold design, molding parameters and molding compound materials.  This innovative design will seek to address all the 3 factors altogether with an innovative approach to combine both transfer and compression molding at one station.

Body 

For side gate molding, a high final pressure will cause wire sweep phenomenon.  However if the final transfer is not created, there will be occurrence of mold voids in the associated package (Fig 1 and 2).  New approaches have been developed to perform granular molding which employs the concept of compression molding.  However the granular molding recipe and technology is not fully matured and can be expensive.

A new approach has to be developed to utilize the compression molding concept into the current conventional transfer molding, using current material recipe. When this concept is adopted, it eliminates the use of expensive granular molding technology.  It also provides better molding parameters (wire movements as compared to a side gate window).  When the initial transfer from the side gate is completed, and the molding material is still in a gel state, the top plate compresses downwards to purge out trapped voids through the venting areas (Fig 3).  ...