Design for High Productive Bond-Off for Wire Bond Process
Publication Date: 2014-Feb-10
The IP.com Prior Art Database
AbstractA design to prevent associated issues during wire bonding process set up, referred to as ‘Bond-Off’, prevents stray wires from contaminating the parent unit.
A design to prevent associated issues during wire bonding process set up, referred to as ‘Bond-Off’, prevents stray wires from contaminating the parent unit.
Bond-Off is a critical wire bonding process where a Free Air Ball (FAB) is created. Typically this is the breaking-off of the wires and is being done on the functional unit itself (Fig. 1). The problem associated with bond-off is that it can cause stray or non-functional wires to fall onto the die top if not removed cleanly, such that the stray wires become a source of contamination.
To prevent stray wires from causing a short to the unit, the bond-off process is performed a short distance away from the active area of the die, but not too far away such that it would cause other additional issues. We propose modifying the wire bonding tool to include a clamp and then performing the bond-off at the clamp (Fig 2). The clamp is located near to, but physically away from the functional unit. This feature can further be enhanced by automating the bond-off material by a roll-on roll-off structure mechanism to make it even more practical for daily use, making it highly productive in nature.
Fig 1: Typical bond-off on the non-active area, within the parent unit
Fig 2: Proposed Bond-Off done on the Clamping Area, with build-in roll on roll-off mechanism