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Magazine Design for Thin Substrate Handling

IP.com Disclosure Number: IPCOM000234841D
Publication Date: 2014-Feb-10
Document File: 3 page(s) / 114K

Publishing Venue

The IP.com Prior Art Database

Abstract

Semiconductor package assembly requires careful handing during assembly and/or testing process. During handling, the semiconductor package strips are required to be supported in carriers or magazines in order to protect them against damages. Especially for high density MAPBGA strips which are getting thinner and thinner to < 0.5mm thickness, special cares usually required as the wider and thinner substrates are more prone to warp or bend. This paper proposes a method for improving substrate warpage in production by redesigning the magazine design.

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TITLE

Magazine Design for Thin Substrate Handling

ABSTRACT

Semiconductor package assembly requires careful handing during assembly and/or testing process. During handling, the semiconductor package strips are required to be supported in carriers or magazines in order to protect them against damages. Especially for high density MAPBGA strips which are getting thinner and thinner to < 0.5mm thickness, special cares usually required as the wider and thinner substrates are more prone to warp or bend. This paper proposes a method for improving substrate warpage in production by redesigning the magazine design.

CONTENT

Current magazine designs produce warpage, as shown in figure 1, due to gravity depending on substrate thickness / weight / size and die size / weight. As MAPBGA bare substrate is getting thinner due to application and consumer requirements, the very thin substrate tends to warp even before assembly.

FIGURE 1: Warpage issue with current magazine design

We propose, as shown in Figure 2, a long curvature support in current magazine design to push the substrate upwards in a gradual curvature in the long direction so that the substrate will not bend in the perpendicular short direction. The long curvature will eventually bend the substrate. The important components of this innovation is the long curvature support in current magazine design to support substrate better during handling process from die bond, wire bond, molding without any major modification on the equipment...