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Die Bond Adhesive Dispensing Cycle Time Improvement

IP.com Disclosure Number: IPCOM000234937D
Publication Date: 2014-Feb-17
Document File: 3 page(s) / 186K

Publishing Venue

The IP.com Prior Art Database

Abstract

Conventional die attach process with pen-writing epoxy dispensing system has a longer cycle time to complete the desirable pattern compared with die pick and place and thus creates a bottleneck and decreases the overall die bond process performance. From the capacity measurement result, it takes approximately 40% of the time to complete the dispensing of full strip substrate in a particular die bond process flow. As such, this creates low device productivity with low throughput (UPH) for that particular die bonding machine. We propose a method to reduce the cycle time needed for die bond. In our method, we create an asterisk or any other symmetrical epoxy dispensing pattern, which improves the UPH at the dispensing system. This is not applicable for other dispensing systems such as epoxy stamping method as the design is based on nozzle type requirement.

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TITLE

Die Bond Adhesive Dispensing Cycle Time Improvement

ABSTRACT

Conventional die attach process with pen-writing epoxy dispensing system has a longer cycle time to complete the desirable pattern compared with die pick and place and thus creates a bottleneck and decreases the overall die bond process performance.  From the capacity measurement result, it takes approximately 40% of the time to complete the dispensing of full strip substrate in a particular die bond process flow.  As such, this creates low device productivity with low throughput (UPH) for that particular die bonding machine.  We propose a method to reduce the cycle time needed for die bond.  In our method, we create an asterisk or any other symmetrical epoxy dispensing pattern, which improves the UPH at the dispensing system.  This is not applicable for other dispensing systems such as epoxy stamping method as the design is based on nozzle type requirement.

CONTENT

A method to reduce the cycle time needed for die bond creates an asterisk or other symmetrical epoxy dispensing pattern using a nozzle dispensing system.  The pattern improves the machine throughput (UPH) at the same time improving the IC packaging productivity.  The proposed epoxy patterns are formed using a nozzle with adjustable dispensing pins, incorporated with a rotatable table. Referring to figure 1, an overview of the dispensing nozzle with a comparison to the current dispensing system is shown.  The figure clearly shows that the distance travel for epoxy pen-write dispensing is shorter when creating an asterisk or other symmetrical pattern as compared to the conventional method.

Figure 1 An overview of the new design of dispensing nozzle with the comparison of current dispensing system.

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