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A Package and PCB Layout to Suppress EMI/EMC

IP.com Disclosure Number: IPCOM000235032D
Publication Date: 2014-Feb-25
Document File: 5 page(s) / 604K

Publishing Venue

The IP.com Prior Art Database

Abstract

We propose an integrated circuit layout scheme to suppress EMI/EMC. In this scheme, we create interlaced power and ground partial planes in the power plane and a small partial power plane in the ground plane. Vertical splits are created in the power plane and a small horizontal split is created in the ground plane. These splits significantly reduce radiation levels and provide a feasible design for high speed packages and boards.

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A Package and PCB Layout to Suppress EMI/EMC

Abstract:

We propose an integrated circuit layout scheme to suppress EMI/EMC.  In this scheme, we create interlaced power and ground partial planes in the power plane and a small partial power plane in the ground plane.  Vertical splits are created in the power plane and a small horizontal split is created in the ground plane.  These splits significantly reduce radiation levels and provide a feasible design for high speed packages and boards.

Contents:

Motivation:

•          Modern systems are approaching high speed of operation. Every day, designers face more significant package and board EMI problems.  There are costly shields available as well as some methods by which better performance may be achieved, but these shields and methods are not fool proof.  We propose a cost effective design that drastically reduces EMI problems, which allows the system to operate efficiently in very harsh environments.

•          As electronic circuit switching occurs, the resultant signal and power profiles experience transients.  These transients are accompanied by electromagnetic radiations.

•          These radiations are bound to occur for higher frequency components of the switching power of signal spectra. The objective is to reduce the overall radiations by containing the maximum power/signal spectra within the system. The existing techniques and the proposed techniques are evaluated against their efficacy to reduce the radiations.

•          We note that there is no extra additional PCB layer or package cost required in designing EMI proof boards and packages using the method proposed in this paper.

Conventional Method 1:  

      Figure 1 - No guard Ring...