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Method of Cross Wire Bonding

IP.com Disclosure Number: IPCOM000235564D
Publication Date: 2014-Mar-10
Document File: 4 page(s) / 947K

Publishing Venue

The IP.com Prior Art Database

Abstract

With the progress of higher pin count demand in integrated circuit packages, it has become more and more challenging for the die designer to maximize the usage of the pin output for each package. This often comes with a cost of tooling up new lead frames or going to a bigger package, which increases cost. Also, the arrangement of the bond pads for certain dies may need to be re-designed for a different package by either re-tooling new lead frames or re-tooling a new IC. All lead frame based packages (QFP and QFN) are limited on how the die is connected to the lead frame and very often the die designer must arrange the pad locations to accommodate the package in order to obtain the required electrical response. In this paper we introduce a method to enable cross-bonding from one side of the die to the opposite side, for a QFP package lead/pin, thus providing flexibility in die to lead frame interconnect.

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Method of Cross Wire Bonding

ABSTRACT

With the progress of higher pin count demand in integrated circuit packages, it has become more and more challenging for the die designer to maximize the usage of the pin output for each package.  This often comes with a cost of tooling up new lead frames or going to a bigger package, which increases cost. Also, the arrangement of the bond pads for certain dies may need to be re-designed for a different package by either re-tooling new lead frames or re-tooling a new IC.  All lead frame based packages (QFP and QFN) are limited on how the die is connected to the lead frame and very often the die designer must arrange the pad locations to accommodate the package in order to obtain the required electrical response.  In this paper we introduce a method to enable cross-bonding from one side of the die to the opposite side, for a QFP package lead/pin, thus providing flexibility in die to lead frame interconnect.

             

CONTENT

            A method of cross bonding from one side of a die bond pad to the opposite side of the package lead/pin through a non-conductive material (substrate) bonded on top of and at the center of the die.  A ball is bonded onto the intended bond pad then a loop is formed and routed to the substrate post (Copper pad) where stitch bonding is performed.  The tail is used to create the 2nd ball and bonded onto the stitch, which is then followed by the standard wire bond process in which the 2nd stitch bond is bonded onto the intend...