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High Density Lead Frame In-Strip Testing Method

IP.com Disclosure Number: IPCOM000235570D
Publication Date: 2014-Mar-10
Document File: 3 page(s) / 475K

Publishing Venue

The IP.com Prior Art Database

Abstract

For high density lead frame and small package, there are challenges for strip testing, which requires each unit in the strip to be isolated for parallel testing compared to singulated units especially for MEMS products. Current solution of in-strip testing is expensive and half-cut process is critical for strip handling (strip becomes flimsy/wavy). This paper discusses how to ensure strip robustness for handling after the half-cut process for strip testing and simplify current Saw-On-Tape (SOT) process steps by using a stiff/rigid tape with thermal heat adhesive.

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High Density Lead Frame In-Strip Testing Method

ABSTRACT

For high density lead frame and small package, there are challenges for strip testing, which requires each unit in the strip to be isolated for parallel testing compared to singulated units especially for MEMS products.  Current solution of in-strip testing is expensive and half-cut process is critical for strip handling (strip becomes flimsy/wavy).  This paper discusses how to ensure strip robustness for handling after the half-cut process for strip testing and simplify current Saw-On-Tape (SOT) process steps by using a stiff/rigid tape with thermal heat adhesive.

CONTENT

There are a few process flows for current in-strip testing, which has its own disadvantages as shown in Figure 1.

Figure 1: Current Process Flows for In-strip Testing

We propose a method as shown in Figure 2, which basically maintains the standard package sawing (half-cut and full-cut) processes, however with additional stiff / rigid tape as support during processing.  During the full cut to assist the sawing, included also a stamped and unique feature as shown in Figure 3, suitable for saw alignment and away from the saw scribe so this will not be sawn away during the half-cut saw process as shown in Figure 3.

Figure 2:  Modified method

                                                Figure 3: Saw Alignment Features

SUMMARY

To support In-strip testing for package size  < 3mm x 3mm in a high density...