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Coating of CB-free-EMC Package with CB-EMC Film

IP.com Disclosure Number: IPCOM000235701D
Publication Date: 2014-Mar-20
Document File: 3 page(s) / 193K

Publishing Venue

The IP.com Prior Art Database

Abstract

Ball grid array packages (BGA) are getting more and more complex in term of their circuitry causing the line space of the plating trace to become narrower and with a tighter pitch. Epoxy mold compound (EMC) used in encapsulation of BGA also is being pushed to its limits by optimizing its flow and materials properties. EMC properties such as finer filler, longer spiral flow, longer gel time, engineered additives, mixing ratio, etc have been aggressively modified to meet current, stringent industry requirements. This paper discusses another EMC improvement for PBGA or MAPBGA package reliability by introducing a Carbon Black (CB) free EMC to eliminate the potential of carbon particles from becoming trapped between the circuit traces resulting in electrically shorting or leakage. The current EMC industry standard EMC has about ~0.3% (weight) of CB. Even though CB dispersion has been improved significantly, the potential for leakage will exist as long as CB is part of the EMC recipe.

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Coating of CB-free-EMC Package with CB-EMC Film

ABSTRACT

Ball grid array packages (BGA) are getting more and more complex in term of their circuitry causing the line space of the plating trace to become narrower and with a tighter pitch.  Epoxy mold compound (EMC) used in encapsulation of BGA also is being pushed to its limits by optimizing its flow and materials properties.  EMC properties such as finer filler, longer spiral flow, longer gel time, engineered additives, mixing ratio, etc have been aggressively modified to meet current, stringent industry requirements.  This paper discusses another EMC improvement for PBGA or MAPBGA package reliability by introducing a Carbon Black (CB) free EMC to eliminate the potential of carbon particles from becoming trapped between the circuit traces resulting in electrically shorting or leakage.  The current EMC industry standard EMC has about ~0.3% (weight) of CB.  Even though CB dispersion has been improved significantly, the potential for leakage will exist as long as CB is part of the EMC recipe.

 

CONTENT

We propose a BGA package that is assembled using CB-free EMC.  Film assist molding with a pre-cut tape that contains a small amount of CB is molded together during the transfer molding.  Figure 1 shows a cross-sectional view of a PBGA package.  The substrate, die and wire encapsulated region is covered with CB-free EMC, which leaves zero opportunity of any CB dispersion or agglomeration that may cause eclectically failur...