Browse Prior Art Database

DEVICE WITH A MICRO- OR NANOSCALE STRUCTURE

IP.com Disclosure Number: IPCOM000235855D
Publication Date: 2014-Mar-27

Publishing Venue

The IP.com Prior Art Database

Abstract

A device with a micro- or nanoscale structure representing one or more of a mechanical structure, a sensing element, an active and/or passive electrical circuitry, comprises a component (1) containing the micro- or nanoscale structure (13), and a support (2) for the component (1). The support (2) contains a recess (23). The component (1) is arranged at least partly in the recess (23). An electrically conducting structure (3) serves for electrically connecting the component (1) to the support (2). The electrically conducting structure (3) is the sole solid connection between the component (1) and the support (2).

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 14% of the total text.

Page 01 of 15

DEVICE WITH A MICRO- OR NANOSCALE STRUCTURE

Abstract

          A device with a micro- or nanoscale structure rep-
resenting one or more of a mechanical structure, a sensing el-
ement, an active and/or passive electrical circuitry, compris-
es a component (1) containing the micro- or nanoscale struc-
ture (13), and a support (2) for the component (1). The sup-
port (2) contains a recess (23). The component (1) is arranged
at least partly in the recess (23). An electrically conducting
structure (3) serves for electrically connecting the component
(1) to the support (2). The electrically conducting structure
(3) is the sole solid connection between the component (1) and
the support (2).

Technical Field

          The present invention relates to a device with a
micro- or nanoscale structure, the mirco- or nanoscale struc-
ture representing one or more of a mechanical structure, a
sensing element, an active and/or passive electrical circuit-
ry.

Background Art

          In many devices comprising electronic and/or me-
chanical integrated structures including sensing elements
these structures may be sensitive to stress. When such struc-
tures are applied to a front side of a substrate, the device
may be arranged with its back side on a carrier and be elec-
trically connected thereto by means of electrically conducting
vias through the substrate.

          It was observed that during mounting of such device
to the carrier, and/or later on during operation, mechanical
stress may be evoked and transmitted via solder balls to the
substrate and specifically to stress sensitive structures of
the device and may damage such structures.


Page 02 of 15

Disclosure of the Invention

          The problem to be solved by the present invention
is therefore to provide a device that is more resistant to me-
chanical stress induced by the mechanical link between a car-
rier and the device.

          This problem is solved by a device with a micro- or
nanoscale structure according to the features described below.
The micro- or nanoscale structure may contain one or more of a
mechanical structure, a sensing element, an active and/or pas-
sive electrical circuitry.

          The device comprises a component with a front side
and a back side which component may in a preferred embodiment
comprise a substrate for arranging the mirco- or nanoscale
structure onto or into. A top and a bottom side typically re-
fer to opposite planes of the component or the substrate re-
spectively, wherein in most instances the dimensions defining
the front and back side i.e. the length and the width of the
component - which in turn define a footprint of the component
- exceed the height of the substrate. In a preferred embodi-
ment, the height of the container may be as small as 150 mi-
crometer or less, and the length and the width each may be as
small as 1 millimeter or less. An exemplary substrate may be a
semiconductor substrate, and specifically a silicon substrate,
however, in other embodiments the substrate may be one of a
glass, a ceramic or a plastic substrate.

          A microscale structu...