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Method and System for Providing Multiple VIA Size Kelvin Structures for Simultaneous Electrical and Physical Characterization

IP.com Disclosure Number: IPCOM000236385D
Publication Date: 2014-Apr-23
Document File: 3 page(s) / 76K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system is disclosed for providing multiple VIA size kelvin structures for simultaneous electrical and physical characterization.

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This is the abbreviated version, containing approximately 75% of the total text.

Page 01 of 3

Method and System for Providing Multiple VIA Size Kelvin Structures for Simultaneous Electrical and Physical Characterization

Disclosed is a method and system for providing multiple via size kelvin structures for simultaneous electrical and physical characterization. The method and system proposes a layout that consists of vias of multiple sizes that are grouped together so that each failure analysis cut can be used to sample multiple via structures. A structure that provides resistivites for multiple vias is provided using a common bus bar astride different ground rule vias.

In accordance with the method and system, the layout facilitates a gathering of electrical and structural data from multiple sized vias simultaneously. Subsequently, different sized vias are arranged in a manner that their centre lines are aligned along a common axis. Above the vias, a common bus bar is used to power the vias on Mx (n+1) level. The vias thus contact bus lines running transversely on the Mx(n) level directly below. Thereafter, by operating the top common bus bar in current-source mode, a voltage drop across the different vias can be sampled independently. A correlation between ISOvia resistance and the barrier / liner coverage on different-sized structures can then be obtained by sectioning along the common centre line shared by the different-sized vias, as shown in the figure 1 and figure 2.

Figure 1

1


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Figure 2

Using judicious layout of SAV and non-SAV vias, th...