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Method of Flexible Bonding Between Dies and Package Pins

IP.com Disclosure Number: IPCOM000236443D
Publication Date: 2014-Apr-25
Document File: 3 page(s) / 1M

Publishing Venue

The IP.com Prior Art Database

Abstract

A multi-layer lead frame is formed by laminating an insulating layer of non conductive material on a lead frame body and then laminating an electrically conductive layer on top of the non-conductive later. The top, conductive layer can be used to provide additional pin output without tooling new lead frames, provide flexibility in pin locations, and provide flexibility in the design and pin shaped, which are limited by lead frames

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TITLE

Method of Flexible Bonding Between Dies and Package Pins

ABSTRACT

A multi-layer lead frame is formed by laminating an insulating layer of non conductive material on a lead frame body and then laminating an electrically conductive layer on top of the non-conductive later.  The top, conductive layer can be used to provide additional pin output without tooling new lead frames, provide flexibility in pin locations, and provide flexibility in the design and pin shaped, which are limited by lead frames

CONTENT

In this paper we describe a method to increase the pin output of a package without tooling new lead frames.  The extra pin output can be of flexible in terms of locations,  size and shape without affecting existing tooled up lead frames.  This saves the cost of tooling up new lead frames.  The structure also helps create an interconnection between two dies with a common pin without tooling up new lead frames.  A coat of a non-conductive material is used as a separation to make the pad electrically nonconductive, and then, on top of the non-conductive layer, another layer of conductive material is deposited to create a bonding area.  The electrically conductive layer can be made by means of sputtering onto the non conductive layer.

The disclosed structure helps solve a few problems where the current lead frame design is limited, as described below.

Summary

We provide a structure that can increase the number of pin outputs without tooling new lead frames. An extra...