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Channeled Lid Foot for Milled Lidded Flip-Chip Package

IP.com Disclosure Number: IPCOM000236560D
Publication Date: 2014-May-02
Document File: 2 page(s) / 162K

Publishing Venue

The IP.com Prior Art Database

Abstract

When attaching a lid to a substrate, the lid adhesive can bleed out to the edge or side wall of the substrate. This bleeding is mainly due to inconsistent lid adhesive weight or the dispense position during machine setup. In this paper we propose a modified lid design that helps prevent the lid adhesive from bleeding out, and therefore reduces the number of rejected parts.

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Channeled Lid Foot for Milled Lidded Flip-Chip Package

Abstract

When attaching a lid to a substrate, the lid adhesive can bleed out to the edge or side wall of the substrate.  This bleeding is mainly due to inconsistent lid adhesive weight or the dispense position during machine setup.  In this paper we propose a modified lid design that helps prevent the lid adhesive from bleeding out, and therefore reduces the number of rejected parts.

Introduction

Lidded Flip-Chip package can use a milled lid that is attached on the die top and substrate. A lid adhesive is used to attach the milled lid to the substrate, as shown in figure 1.  If the lid adhesive bleeds out to the edge or side wall of the substrate (see figure 2), the unit will be rejected and scrapped.  The milled lid foot has a higher tendency for lid adhesion to bleed out due to flat design at the bottom foot area (see drawing 1).

               

Design and Implementation

We propose a forming a quarter-like channel at the bottom area of lid foot.  With this design, the lid adhesive will be captured within the lid during the lid attach process so it will not bleed out to the edge or side wall of the substrate.  

The important components of the design are:

                1. The channeled lid foot will not impact the pick and place process for lid.

                2. The forming of dome-shape like lid adhesive will hold the lid firmly on the substrate.

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