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In-Plane Heat Mitigation Channels for PCBs

IP.com Disclosure Number: IPCOM000236789D
Publication Date: 2014-May-15
Document File: 9 page(s) / 93K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method to provide fresh unheated air to locations downstream of a typical air-cooled server. Current air-cooled systems cannot reliably achieve cool airflow to various components due to their placement or preheat.

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This is the abbreviated version, containing approximately 67% of the total text.

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--Plane Heat Mitigation Channels for PCBs

Plane Heat Mitigation Channels for PCBs

Thermal management challenges are becoming a major roadblock to the wide use of high-power devices. Incremental improvements in conventional bulk metal heat sinks and thermal interface materials are projected to be insufficient to meet these challenges. Active cooling methods, such as forced air and pumped liquid cooling, may provide better performance but at the expense of higher cost and energy consumption. Passive phase change (liquid to vapor) cooling devices, such as heat pipes, are well established in the electronics industry as a very effective and reliable way of removing excess waste heat at low thermal resistance. Successful application of heat pipes in products will require adapting the technologies to the form-factor, material, and cost requirements unique to the required chipsets. This disclosure describes a novel way to introduce air pockets in the PCB near the high-powered devices which could be used to remove heat from the PCB board via existing cooling architecture.

    This disclosure describes a method to provide fresh unheated air to locations downstream of a typical air-cooled server. Current air-cooled systems cannot reliably achieve cool airflow to various components due to their placement or preheat. While a typical solution to cooling these components is to increase fan speeds, it is still possible to have components in poor flow regimes or components th...