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Semiconductor package

IP.com Disclosure Number: IPCOM000236839D
Publication Date: 2014-May-19

Publishing Venue

The IP.com Prior Art Database

Abstract

A semiconductor package comprises an integrated device, a front side (1) of a material A and a back side (2) of a material B opposite to the front side (1). Side walls (3) link the front side (1) and the back side (2). Each side wall (3) is coated with a coating material (4) to at least 80 % of its area, wherein the coating material (4) is different from the material A and different from the material B.

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Page 01 of 17

Semiconductor package

ABSTRACT

A semiconductor package comprises an integrated device, a
front side (1) of a material A and a back side (2) of a
material B opposite to the front side (1). Side walls (3)
link the front side (1) and the back side (2). Each side
wall (3) is coated with a coating material (4) to at
least 80 % of its area, wherein the coating material (4)
is different from the material A and different from the
material B.

FIELD OF THE INVENTION

          The present invention relates to a semicon-
ductor package and a method for manufacturing a semicon-
ductor package.

BACKGROUND OF THE INVENTION

          When a semiconductor device is packaged, es-
pecially in a batch process, undesired particles may
arise during device dicing, e.g. by sawing or laser cut-
ting.

          In KR100395754 B1 for example, a pre-cutting
process is performed by cutting particular units of a
semiconductor package. The particular units of the semi-
conductor package are cut by using a dicing wheel. A
cleaning and a drying process is performed to clean cut
sludge caused by the pre-cutting process. A laser beam
cutting process is performed by cutting the remaining
thickness of the semiconductor package.

          In such a process, contamination may arise in
form of particles released from the cut surfaces or there
may be thermal impact arising from the laser cutting
step.


Page 02 of 17

SUMMARY OF THE INVENTION

          Hence, according to a first aspect of the in-
vention, there is provided a semiconductor package, com-
prising an integrated device, a front side of a material
A and a back side of a material B opposite to the front
side. Side walls link the front side and the back side.
Each side wall is coated with a coating material to at
least 80 % of its area, wherein the coating material is
different from the material A and different from the ma-
terial B.

          The term "semiconductor package" as used
herein comprises an integrated device which may comprise
one or more of a die, a chip, a substrate, e.g. a glass
substrate or a ceramic substrate or a semiconductor sub-
strate, and in particular a silicon substrate. The semi-
conductor package may further comprise means of electri-
cal contacting, e.g. one or more of wire bonds, through-
silicon-vias, a ball grid array, a land grid array, T-
contacts, a lead frame or a printed circuit board, and/or
packaging, e.g. a mold or a silicon cap or a silicon in-
terposer. The semiconductor package, and in particular
its integrated device may include features such as an in-
tegrated processing circuit and/or a suspended membrane
and/or a heater structure.

          In a preferred embodiment, the semiconductor
package, and in particular its integrated device compris-
es a sensitive element which is sensitive to one or more
of humidity, temperature, gas, pressure, gas flow or dif-
ferential pressure.

          Hence, the semiconductor package may repre-
sent one or more of a humidity sensor, a temperature sen-
sor, a gas sensor, a pressure sensor, a microphone, or a
gas flow sensor.

          Furthermore, the semiconductor packa...