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Scribe line optimization to minimize coupling during RF testing

IP.com Disclosure Number: IPCOM000236934D
Publication Date: 2014-May-22
Document File: 2 page(s) / 117K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to use a segmented shield between the scribe line structures and the die to minimize coupling between neighboring die during Radio Frequency (RF) testing. This eliminates false fails due to Radio Frequency (RF) coupling.

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Scribe line optimization to minimize coupling during RF testing

Radio Frequency (RF) signals can couple to metal structures, such as guard rings and scribe line structures. Coupling between neighboring die during RF testing, through metal in scribe line structures, can result in an apparent yield loss (even though the die yield is high after the scribe line structures are removed). It is important to have an accurate wafer level test, so that good die are not inadvertently discarded (i.e. due to RF coupling to a neighboring die). Hence, an improved scribe line layout is needed to reduce coupling between die during RF testing.

Figure 1: Problem: During RF testing at wafer level, noise can couple to neighboring die through scribe line test structures

Figure 2: Wafer level RF test; yield depends on neighboring scribe line structure

The novel solution uses a segmented shield between the scribe line structures and the die to minimize coupling between neighboring die during RF testing. By reducing the coupling between die, the functionality of good die can be verified, eliminating false fails

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due to RF coupling.

Figure 3: Solution: Add segmented metal shield next to scribe line structures

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