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Generic Device With Adaptive Thermal Characteristics

IP.com Disclosure Number: IPCOM000237088D
Publication Date: 2014-May-30
Document File: 3 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a low-cost, adaptive thermal signature device used during new systems bring-up and early validation that can create the appropriate thermal signatures of other devices that are not available at the time of testing.

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Generic Device With Adaptive Thermal Characteristics

A common problem during new systems bring-up and early validation is the lack of hardware components for adequate testing. This shortage is caused by several factors, especially cost restrictions on a corporate business unit or a manufacturer. Because of this, systems in the early stages of development typically cannot be tested under full thermal loads. For example, if there is a shortage of certain high-capacity Dual In-Line Memory Modules (DIMMs), the thermal loads ordinarily generated by those DIMMs as part of system operation are absent from the system. Scaled-out over an entire product development program, the effects of these problems can be serious and result in delays or quality issues.

A device is needed that can be made widely available to test laboratories for creating the appropriate thermal signatures of other devices that are not available at the time of testing.

The novel contribution is a low-cost, adaptive thermal signature device that has the ability to receive, as input, the thermal attributes of higher-cost, scarcer devices. The device can also generate thermal loads (and/or power loads) and signatures of those higher-cost devices within an operating environment. In addition, the device can adjust load as a function of performance detected in adjacent DIMMs in the channel.

The ability to detect performance at the Double Data Rate Physical (DDR PHY) layer has benefits since the thermal DIMM(s) does not incur a software delay penalty by waiting for the operating system (OS) to measure performance and appropriately set the load. This adjustment can be done in real time as the memory controller increases or decreases access to the adjacent DIMM. This has even greater value when thinking in terms of power loads where fast response time is important.

Components of the Invention:


 A generic device, having the form factor of a memory module that can populate a DIMM socket within a computer system


 Said generic device also having a heat-generating element for purposes of thermal load generation (Figure 1)


 Said generic device also having an electrical load element for purposes of Voltage-Regulator Down (VRD) load generation


 A Field Programmable Gate Array (FPGA) interface to facilitate communication with controllers (including DDR memory controller), as shown in Figure 1


 A thermal load mapping table that correlates the number of read/write operations to resulting thermal signatures within a system (e.g., a table the shows the number of direct input/output (I/O) operations that cause a DIMM to operate at 65 degrees Celsius)


 An on-device temperature sensor


 An o...